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By the time you add up the necessary bill of materials and the work it would take to assembe/integrate (custom PCB, lots of fly wires, etc), it's more cost-effective to just design and manufacture an integrated PCB to begin with, and that would give you far more options with respect to the final form factor. But that leads to the real problem -- the enclosure. The only way for it to be remotely cost-competitive would require mass producing a case, which in turn requires very expensive tooling. Literally everything else can be done incrementally on a shoestring budget, but a case is looking at a six-digit price tag, up front. 3D printing can be used for low-volume prototyping but again, cost-prohibitive for anything we'd expect the general public to purchase.
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