I could quickly do some quick PCBa design around it.
Unless you were planning on carrying a bare PCB around or the same
stuffed into a clunky enclosure, fabing a PCB really isn't the problem.
Rather it is the mechanical design of the device which torpedoes these
I suppose if you could accept a 3D printed enclosure that may be a partial
solution. But given the effective resolution of even commercial printers
it isn't something I'd want to brag about. For small quantity runs it might be
feasible to CNC machine enclosures using a well fixtured blank. You'll
still need to address surface finish quality but would be in a far better
starting point relative to printing. Still you'd never reach the level of quality
achieved with large scale injection molded components from insanely
This is assuming you have a design ready to manufacture. Getting there is
no mean feat with interdependent tradeoffs between display technology and
available footprints; battery technology, footprint, runtime, interconnect, etc..
No doubt you could amass the engineering talent needed to get the job done
particularly in the context of a collaborative, open effort. But successfully
executing the manufacturing task is usually where such projects fizzle out.